HP Inc. Quietly Taps Debt Markets and Borrows Another $1 Billion in Two-Part Bond Deal.

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HP Inc. Quietly Taps Debt Markets and Borrows Another $1 Billion in Two-Part Bond Deal.
HP Inc. (NYSE: HPQ) is discreetly raising another $1 billion through a two-part senior unsecured note offering. The issuance includes: $500 million of 5.400% notes maturing in 2030, priced at 99.732% of face value. $500 million of 6.100% notes maturing in 2035, priced at 99.778% of face value.

Proceeds from the offering will be used for general corporate purposes, which may include refinancing HP’s 2.200% notes due in June 2025. The deal is expected to close on April 25, 2025, pending customary closing conditions.

BNP Paribas Securities, BofA Securities, Goldman Sachs, J.P. Morgan Securities, and Wells Fargo Securities are acting as joint bookrunners on the transaction.

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April 15, 2025 at 3:13 PM